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Annotation
В работе рассмотрены теоретические аспекты диффузионной пайки, пайки в вакууме, особенности пайки разнородных материалов. Рассмотрены методики и оборудование для проведения пайки разнородных материалов. Показана возможность пайки разнородных материалов:керамика-медь, керамика-титан.
Theoretical aspects of diffusion soldering, soldering in vacuum and feature of soldering of dissimilar materials were considered. Methods and equipment from soldering of dissimilar materials were considered. Opportunity of soldering of ceramics-titanium and ceramics-copper were shown.
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