Details
Title | Advanced liquid metal cooling for chip, device and system |
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Creators | Liu Jing |
Imprint | Singapore [etc.]: World Scientific, cop. 2022 |
Collection | Электронные книги зарубежных издательств; Общая коллекция |
Subjects | Металлы жидкие; Электронные приборы — Охлаждение; World Scientific Publishing eBooks Collection |
UDC | 669.017-154; 621.38-71 |
Document type | Other |
File type | Other |
Language | English |
Rights | Свободный доступ из сети Интернет (чтение, печать) |
Additionally | New arrival |
Record key | RU\SPSTU\edoc\73816 |
Record create date | 9/13/2024 |
This compendium summarizes the core principles and practical applications of a brand-new advanced chip cooling category - liquid metal cooling. It illustrates the science and art of room temperature liquid metal enabled cooling for chip, device and system. The concise volume features unique scientific and practical merits, and clarified intriguing liquid metal coolant or medium behaviors in making new generation powerful cooling system. With both uniquely important fundamental and practical values, this useful reference text benefits researchers to set up their foundation and then find new ways of making advanced cooling system to fulfil the increasingly urgent needs in modern highly integrated chip industry.
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