Encyclopedia of packaging materials, processes, and mechanics. Set 1: Interconnect and wafer bonding technology: (in 4 volumes). Vol. 1. Flip-chip and underfill materials and technology. Vol. 2. Wire bonding technology. Vol. 3. Flexible chip I/O interconnects. Vol. 4. Wafer bonding technology / editor-in-chief Avram Bar-Cohen [et al.]. — Singapore [etc.]: World Scientific, cop. 2019. — 1 файл. — Загл. с титул. экрана. — Электронная версия печатной публикации. — Доступ по паролю из сети Интернет (чтение, печать). — <URL:https://www.worldscientific.com/worldscibooks/10.1142/11303#t=toc>. — Текст: электронный
| Period | Read | Copy | Open | Total | ||
|---|---|---|---|---|---|---|
| Year 2024 | Quarter 4 | 0 | 0 | 0 | 2 | 2 |
| Year 2025 | Quarter 1 | 0 | 0 | 0 | 1 | 1 |
| Quarter 2 | 0 | 0 | 0 | 0 | 0 | |
| Quarter 3 | 0 | 0 | 0 | 0 | 0 | |
| Quarter 4 | 0 | 0 | 0 | 1 | 1 | |
| Total | 0 | 0 | 0 | 4 | 4 | |